Chemical Mechanical Planarization

Chemical Mechanical Planarization Silica Sol Abrasives

Chemical mechanical planarization (CMP) removes material from the surface of a wafer to achieve a high-quality foundation for the next layer of a circuit or as a final polishing step. Our next-generation CMP silica sol abrasives are designed to enable targeted selectivity, low defectivity and scratch rate, fast removal rate and high stability in slurry formulation. 

We offer a range of colloidal silica abrasives for CMP to cover different slurry needs for different chip types and layers. The abrasive particles have a size distribution, hardness, morphology and surface profile which directly affect critical metrics, including removal rate and wafer defects.

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High Purity Colloidal Silica Products for CMP

  • Size: Engineered
  • Solid: 30%
  • pH: 8.9-9.5
  • Potassium stabilized

  • Size (nm): 35
  • Area m2/gm: 85
  • % Solids: 30 
  • pH: 9-10 
  • Stabilizing: K+

  • Size (nm): Engineered 
  • Area m2/gm: 85 
  • % Solids: 50 
  • pH: 9-10 
  • Stabilizing: K+

  • Size (nm): Engineered 
  • Area m2/gm: 50 
  • % Solids: 50 
  • pH: 8.5

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Customized CMP Abrasive Product Development

Our experienced dedicated RD&E teams provide customized silica sol product development to deliver solutions that are tailored to specific business needs and processes. We design products covering a wide range of:

  • Particle Size
  • Particle Size Distribution
  • Stabilized Cation
  • 浓度
  • pH值
  • Package Type
  • Temperature Condition
  • Classification
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Colloidal Silica Product Quality and Consistency

Nalco Water focuses on quality, consistency, and reliability throughout all our colloidal silica solutions. To ensure that our silica sol performs correctly in CMP applications, we look to IPC standards to guide our quality control testing.

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Nalco Water is a Colloidal Silica Leader

  • First patented colloidal silica manufacturing process in 1941
  • One of the largest colloidal silica manufacturers globally
  • Innovative RD&E teams for customized product development
  • Products designed for manufacturing efficiency, quality, and control
  • Delivering high value through innovative particle design and quality support

Contact Our Colloidal Technologies Experts

Let us know how we can help.

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参考资料

  1. Products were made using LMSII engineered approach to remove metals; [Cu] and [Ni] less than 20 ppb, Availability subject to the volume↵