Prime Wafer

Prime Wafer Polishing Slurries

Nalco Water has supplied colloidal silica to the wafer industry for decades, and our comprehensive and wide-ranging expertise allow us to produce some of the highest quality silicon polishing slurries in the industry. 

Our highly stable colloidal silica products offer exceptional purity, controlled particle size, distribution, and morphology for optimum performance in your prime wafer polishing processes.

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Designing Wafer Polishing Slurries For:

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High removal rates

 

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Steady performance

 

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Low defectivity

 

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Excellent surface finish and planarity


Ready-to-use Colloidal Silica Slurries for Silicon Wafer Polishing

  • Size (nm): 60 
  • pH: 11 
  • Stabilizing: Na+

  • Size (nm): 60 
  • pH: 8.5 
  • Stabilizing: Na+

  • Size (nm): 85 
  • pH: 11-12 
  • Stabilizing: NH4 
  • Notes: Chelating additive

  • Size (nm): 85 
  • pH: 11-12 
  • Stabilizing: NH4 
  • Notes: High Si removal rate. Hazardous.

  • Size (nm): 120
  • Area m2/gm: 25
  • % Solids: 47
  • pH: 9-10
  • Stabilizing: K+

Chemical Mechanical Planarization

Addressing Multiple Polishing Applications

Our colloidal silica-based polishing slurries are widely used for the stock polish, edge polish and final polish steps in the manufacture of silicon wafers and other semiconductor substrates for microchips.

此类抛光液还可用于对光学器件、钟表玻璃及其他玻璃元件的表面进行精密加工。

适用于抛光的纳米颗粒

Innovating for the Needs of CMP Slurry Formulators

Nalco Water has aligned our colloidal silica manufacturing capabilities to deliver high-purity, innovative nanoparticles to meet the needs of the CMP slurry formulator.

  • Ultra-high purity waterglass-based nanoparticles
  • 各类颗粒尺寸、粒径分布及浓度
  • 可在广泛的pH范围内保持性质稳定的工程产品
  • 密切的研发合作关系
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Nalco Water is a Colloidal Silica Leader

  • First patented colloidal silica manufacturing process in 1941
  • One of the largest colloidal silica manufacturers globally
  • Innovative RD&E teams for customized product development
  • Products designed for manufacturing efficiency, quality, and control
  • Delivering high value through innovative particle design and quality support

Contact Our Colloidal Technologies Experts

Let us know how we can help.

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参考资料

  1. Products were made using LMSII engineered approach to remove metals; [Cu] and [Ni] less than 20 ppb. Availability subject to the volume.↵